Diasemi's Cu-Diamond composite material
Diasemi's Cu-Diamond composite material offers high thermal conductivity, a low thermal expansion coefficient, excellent corrosion resistance, and strong weldability. We tailor our products to meet your specific requirements, with thermal conductivity options of 600, 800, and 1000 W/mK. For more detailed information, please reach out to us at diasemi.us. www.diasemi.us sales@semixicon.com