Diasemi's Cu-Diamond composite material
Diasemi's Cu-Diamond composite material offers high thermal conductivity, a low thermal expansion coefficient, excellent corrosion resistance, and strong weldability.
We tailor our products to meet your specific requirements, with thermal conductivity options of 600, 800, and 1000 W/mK.
For more detailed information, please reach out to us at diasemi.us.
www.diasemi.us
sales@semixicon.com
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