Diasemi's Cu-Diamond composite material

Diasemi's Cu-Diamond composite material offers high thermal conductivity, a low thermal expansion coefficient, excellent corrosion resistance, and strong weldability.

We tailor our products to meet your specific requirements, with thermal conductivity options of 600, 800, and 1000 W/mK.

For more detailed information, please reach out to us at diasemi.us.

www.diasemi.us

sales@semixicon.com


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