Diamond Semiconductor

  Introducing DIASEMI DIASIC Series: Advanced Diamond-Silicon Carbide (SiC) Composite Materials Engineered for extreme environments, the DIASEMI DIASIC Series combines the unparalleled hardness of diamond with the exceptional thermal conductivity and chemical resistance of silicon carbide (SiC). This ultra-durable composite material excels in heat management, wear resistance, and corrosion protection—perfect for demanding industrial and high-tech applications. 🔹 Superior Hardness (Up to 48 GPa) – Ideal for high-wear components, bearings, and cutting tools. 🔹 Exceptional Thermal Conductivity – Optimized for high-power electronics, GaN transistors, and thermal management solutions. 🔹 Outstanding Chemical Resistance – Withstands harsh acids, alkalis, and hydrothermal conditions. 🔹 Customizable Designs – Available as SiC-diamond composites, diamond coatings, or se...

  Introducing DIASEMI’s DiaCu Diamond-Copper Composite: The Ultimate High-Thermal-Conductivity TIM for Power Electronics, Laser Cooling & Semiconductor Thermal Management DIASEMI—a pioneer in MPCVD diamond wafer technology—presents DiaCu, a breakthrough diamond-copper (Cu) composite engineered for extreme heat dissipation in high-power electronics, RF/microwave systems, and advanced semiconductor devices. Key Specifications ✔ Dimensions: 4-inch (100mm) diameter × 5mm thickness (custom sizes available) ✔ Material: Diamond-copper hybrid matrix ✔ Thermal Conductivity: >600 W/mK (ultra-high performance) ✔ CTE (Coefficient of Thermal Expansion): Low, minimizing thermal stress ✔ Mechanical Strength: High durability with lightweight diamond-metal structure DIASEMI Diamond-Copper TIM: Unmatched Thermal Management – Combines CVD diamond’s 2000+ W/mK conductivity with copper’s heat...