Introducing DIASEMI’s DiaCu Diamond-Copper Composite: The Ultimate High-Thermal-Conductivity TIM

 Introducing DIASEMI’s DiaCu Diamond-Copper Composite: The Ultimate High-Thermal-Conductivity TIM for Power Electronics, Laser Cooling & Semiconductor Thermal Management

DIASEMI—a pioneer in MPCVD diamond wafer technology—presents DiaCu, a breakthrough diamond-copper (Cu) composite engineered for extreme heat dissipation in high-power electronics, RF/microwave systems, and advanced semiconductor devices.

Key Specifications

✔ Dimensions: 4-inch (100mm) diameter × 5mm thickness (custom sizes available)

✔ Material: Diamond-copper hybrid matrix

✔ Thermal Conductivity: >600 W/mK (ultra-high performance)

✔ CTE (Coefficient of Thermal Expansion): Low, minimizing thermal stress

✔ Mechanical Strength: High durability with lightweight diamond-metal structure

DIASEMI Diamond-Copper TIM:

Unmatched Thermal Management – Combines CVD diamond’s 2000+ W/mK conductivity with copper’s heat spreading for GaN, SiC, IGBTs, and HEMTs.

High-Power & High-Frequency Ready – Minimizes thermal resistance in 5G/6G, RF amplifiers, and THz components.

Reliable in Extreme Conditions – Oxidation-resistant, corrosion-proof, and stable in high-temp, vacuum, and harsh environments.

Lightweight & Durable – Stronger than pure copper with lower density, ideal for aerospace & medical cooling.

Industry-Leading Applications

Power Electronics: GaN & SiC devices, power modules, EV inverters

RF & Microwave: Radar systems, satellite comms, RF power amplifiers

Laser & Photonics: Diode laser heat sinks, ultrafast optics cooling

Aerospace & Defense: Avionics thermal management, X-ray tube cooling

Custom Solutions Available

• Tailored thickness & dimensions

• Optimized for brazing, soldering, or direct bonding

• Compatible with semiconductor packaging processes

Upgrade to the Future of Thermal Management with DIASEMI’s DiaCu!

📩 Contact Us: sales@semixicon.com

🌐 Learn More: www.diasemi.us

#DiamondCopper #ThermalInterfaceMaterial #HighThermalConductivity #GaNCooling #SiCThermalManagement #MPCVDdiamond #HeatSpreader #PowerElectronics #RFcooling #LaserDiodeCooling #5Gthermal #WideBandgap #TIM #DiamondMetalMatrix #LowCTE

#GaNdevices #graphiteheatspreaders #Ultrahighthermalconductivitymaterials

#RFpoweramplifiers #MPCVDdiamondwafer #Heatdissipation #laserdiodes

#LowCTEthermalinterfacematerial #Diamondmetalcomposite

#EVpowermodules #Highfrequencyelectronicscooling

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