Diamond Semiconductor

Revolutionize Heat Dissipation with DIASEMI’s Aluminum-Diamond Composite Material High Thermal Conductivity | Lightweight Thermal Interface | Advanced Heat Spreader for Power Electronics DIASEMI, a leading supplier of CVD diamond and composite thermal materials, introduces its latest innovation: the Aluminum-Diamond (Al-D) Composite. This next-generation thermal management material combines the lightweight strength of aluminum with the exceptional thermal conductivity of synthetic diamond, providing an optimal solution for high-performance electronic cooling systems. 🔧 Key Technical Properties: Ultra-High Thermal Conductivity: Exceeds 500 W/m·K, outperforming pure copper and most metal matrix composites Optimized Coefficient of Thermal Expansion (CTE): ~6 ppm/K at room temperature – matches semiconductor substrates such as GaN, Si, SiC Low Density: ~3.17 g/cm³ – significantly lighter than copper or tungsten-based materials 🌟 Advantages of Aluminum-Diamond Composite for Thermal Soluti...

  DIASEMI Copper Diamond Composite – Advanced Thermal Management for High-Power Electronics Optimize your thermal solutions with DIASEMI’s Copper Diamond Composite, a high-performance thermal material engineered for ultra-efficient heat dissipation in demanding applications. Combining the exceptional thermal conductivity of diamond with the electrical and mechanical benefits of copper, this diamond metal matrix composite (DMMC) is ideal for high-power electronics, semiconductor cooling, and next-gen thermal management. Key Features: ✅ Ultra-High Thermal Conductivity (800 W/m·K) – Outperforms traditional materials like copper-tungsten (CuW), aluminum nitride (AlN), and beryllium oxide (BeO). ✅ CTE-Matched to Semiconductors (6.8–7.3 ppm/°C) – Minimizes thermal stress in GaN, SiC, and GaAs devices. ✅ High-Temperature Stability – Maintains 550 W/m·K at 325°C, ideal for power electro...