DIASEMI Copper Diamond Composite – Advanced Thermal Management for High-Power Electronics
DIASEMI Copper Diamond Composite – Advanced Thermal Management for High-Power Electronics
Optimize your thermal solutions with DIASEMI’s Copper Diamond Composite, a high-performance thermal material engineered for ultra-efficient heat dissipation in demanding applications. Combining the exceptional thermal conductivity of diamond with the electrical and mechanical benefits of copper, this diamond metal matrix composite (DMMC) is ideal for high-power electronics, semiconductor cooling, and next-gen thermal management.
Key Features:
✅ Ultra-High Thermal Conductivity (800 W/m·K) – Outperforms traditional materials like copper-tungsten (CuW), aluminum nitride (AlN), and beryllium oxide (BeO).
✅ CTE-Matched to Semiconductors (6.8–7.3 ppm/°C) – Minimizes thermal stress in GaN, SiC, and GaAs devices.
✅ High-Temperature Stability – Maintains 550 W/m·K at 325°C, ideal for power electronics and harsh environments.
✅ Customizable Solutions – Available in various sizes, thicknesses, and metallization (Au, Ag, Ni) for direct bonding (sintering, soldering, brazing).
Applications:
🔹 Power Electronics – IGBT modules, SiC/GaN devices, RF power amplifiers, and high-frequency circuits.
🔹 Laser & Optoelectronics – Laser diode submounts, high-power laser cooling, and photonic packaging.
🔹 Aerospace & Defense – Radar T/R modules, satellite thermal management, and avionics cooling.
🔹 EV & Automotive – Electric vehicle inverters, ADAS sensors, and battery thermal management.
🔹 5G & Telecom – High-power RF devices and base station cooling solutions.
📞 Get a Quote Today!
For custom thermal solutions, datasheets, or samples, contact DIASEMI:
📧 Email: sales@semixicon.com
🌐 Website: www.diasemi.us
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