Diamond Semiconductor

Electrostatic Chuck (ESC) Repair Services – SEMIXICON Your Trusted Partner for Precision ESC Refurbishment & Reconditioning SEMIXICON, a specialist in electrostatic chuck (ESC) repair and refurbishment, offers multi-level ESC maintenance services tailored to meet the needs of OEMs and semiconductor fabs. Our ESC repair capabilities restore performance, reduce downtime, and extend the life of your electrostatic chucks, helping you lower total cost of ownership in critical wafer processing applications. *** ESC Repair Capability Levels Level 1 – Surface Reconditioning & Inspection Ideal for minor surface wear, contamination, or preventative maintenance. ✅ Visual & Ceramic Surface Inspection – Identify cracks, chipping, discoloration ✅ MCA Pad & Electrical Testing – Evaluate pad condition and electrostatic chucking performance ✅ Contaminant Removal – Ultrasonic or chemical cleaning to eliminate particles and residues ✅ PAD Regeneration – Recoat or rebuild MCA pad to re...

     Engineering Precision in Ultra-Pure Silicon Components | SEMIXICON At SEMIXICON, we engineer the foundation of advanced semiconductor manufacturing — Ultra-High-Purity Silicon Components. For fabs running 200mm and 300mm wafer processes, our precision materials are critical to achieving superior yield, uniformity, and device performance. Our Specialties 1. Semiconductor-Grade Polycrystalline Silicon Feedstock The base material for all critical silicon components. Purity: >99.9999% (6N+) to meet stringent contamination control requirements. Resistivity: >1,000 Ω·cm — ensures minimal dopant interference for epitaxial and crystal growth applications. 2. High-Density Silicon Sputtering Targets Designed for uniform thin-film deposition and minimal particle generation in advanced PVD systems. Purity: Maintains 6N+ base purity. Density: >99.5% of theoretical, reducing arcing and nodule formation. Particle Performance: <0.05 particles/cm² (>0.2 µm) under ba...

Introducing Panel-Level Packaging (PLP) & SEMIXICON’s Extra-Large Porous Ceramic Vacuum Chuck 📘 What is PLP? Panel-Level Packaging (PLP) extends wafer-level packaging (WLP) to larger rectangular panels — similar to PCB panels — enabling more dies to be processed in a single batch and significantly reducing cost per die. ⚙️ Key Process Flow • Panel substrate prep (organic, glass, or molded panels) • Die placement and reconstitution • Redistribution layer (RDL) formation • Bumping, molding, thinning, and singulation 📐 Typical Panel Sizes Standard panels reach 18” × 24” or larger, even exceeding 500 × 500 mm(custom from 500mmX500mm up to 3000mmX3000mm), providing far greater capacity than traditional wafers. 🌟 Advantages ✅ Higher throughput & lower manufacturing cost ✅ Ideal for heterogeneous integration & fan-out packaging ✅ Scalable production using PCB-like processes ✅ Supports larger and mixed-die assemblies ⚠️ Challenges • Managing panel warpage and dimension...