Introducing Panel-Level Packaging (PLP) & SEMIXICON’s Extra-Large Porous Ceramic Vacuum Chuck

Introducing Panel-Level Packaging (PLP) & SEMIXICON’s Extra-Large Porous Ceramic Vacuum Chuck

📘 What is PLP?

Panel-Level Packaging (PLP) extends wafer-level packaging (WLP) to larger rectangular panels — similar to PCB panels — enabling more dies to be processed in a single batch and significantly reducing cost per die.

⚙️ Key Process Flow

• Panel substrate prep (organic, glass, or molded panels)

• Die placement and reconstitution

• Redistribution layer (RDL) formation

• Bumping, molding, thinning, and singulation

📐 Typical Panel Sizes

Standard panels reach 18” × 24” or larger, even exceeding 500 × 500 mm(custom from 500mmX500mm up to 3000mmX3000mm), providing far greater capacity than traditional wafers.

🌟 Advantages

✅ Higher throughput & lower manufacturing cost

✅ Ideal for heterogeneous integration & fan-out packaging

✅ Scalable production using PCB-like processes

✅ Supports larger and mixed-die assemblies

⚠️ Challenges

• Managing panel warpage and dimensional stability

• Precise alignment & defect control across large surfaces

• Industry standardization still evolving

💡 Applications

High-end mobile, automotive radar, AI accelerators, power modules, and next-generation advanced packaging platforms.

🏁 SEMIXICON’s Solution

SEMIXICON proudly provides extra-large porous ceramic vacuum chucks engineered for panel-level packaging equipment, offering exceptional flatness, uniform vacuum distribution, and structural stability.

🧩 Available Dimensions:

• 1064 × 40 × 991 mm

• 1064 × 40 × 701 mm

Once again, we’re ready to take the “extra-large” challenge in advanced semiconductor packaging.

🔗 Learn more: www.semixicon.com, or sales@semixicon.com

#PLP #AdvancedPackaging #Semiconductor #WaferHandling #PorousCeramicChuck #PanelLevelPackaging #WaferProcess #EngineeringInnovation #VacuumChuck



Comments

Post a Comment

Popular posts from this blog

DIASEMI is a U.S.-based supplier and fabricator of MPCVD diamond materials.

Image
DIASEMI is a U.S.-based supplier and fabricator of MPCVD diamond materials. Today we present one of our innovations: Diamond Heat Sink (16 pieces 20x0.5mm are available in stock) Specification Overview: Diamond heat sinks are designed for superior thermal management in high-power electronic and optoelectronic applications. Leveraging the exceptional properties of synthetic diamonds, these heat sinks deliver unparalleled thermal conductivity, electrical insulation, and mechanical stability, ensuring optimal performance and reliability in demanding environments. Key Features: Thermal Conductivity: Up to 2200 W/mK, offering industry-leading heat dissipation. Electrical Insulation: Excellent dielectric properties for safe use in sensitive electronic devices. Lightweight and Durable: High strength-to-weight ratio with exceptional hardness and wear resistance. Thermal Expansion: Low coefficient of thermal expansion (CTE) compatible with common semiconductor materials. Chemical Stability: Hi...
Read more

OPTICAL GRADE DIAMOND, Manufactured by DIASEMI, a U.S.-based company.

Image
OPTICAL GRADE DIAMOND, Manufactured by DIASEMI, a U.S.-based company. DIASEMI offers outstanding optical diamonds, with transmittance across UV, visible, IR, and microwave bands, with optical transmittance exceeding 70%. It is an exceptional optical material combining superior mechanical, thermal, and electrical properties with excellent chemical stability. Resilient against harsh environments, it adapts well to complex and fluctuating conditions. Single-crystalline diamond (>10mm): 71% infrared transmittance Polycrystalline diamond (1-4 inches): 68-70% infrared transmittance Applications span various fields, including: Infrared windows for airborne, missile, and ship-borne search and tracking systems High-power CO2 and solid-state laser weaponry High-energy microwave feed windows and weaponry Thermonuclear fusion reactors Optics such as windows, prisms, and lenses for spectroscopy and medical applications Specifications: Dimension: Customizable Thickness: Customizable Transmittance...
Read more

DIASEMI: Diamond-Coated Silicon Wafers

Image
DIASEMI: Diamond-Coated Silicon Wafers Product Overview: DIASEMI offers high-quality diamond-coated silicon wafers, combining the exceptional properties of diamond with the versatility of silicon substrates. These wafers are ideal for applications requiring superior thermal management, mechanical durability, and chemical resistance. Key Features: Material Composition: Substrate: Monocrystalline silicon wafer Coating: Chemical Vapor Deposition (CVD) diamond layer Thermal Properties: Thermal Conductivity: Diamond layer: 1800–2000 W/m·K Operating Temperature Range: Up to 1000°C Mechanical Properties: Hardness: Diamond layer: Vickers hardness >70 GPa Young’s Modulus: Diamond layer: ~1050 GPa Electrical Properties: Electrical Resistivity: Diamond layer: >10⁶ Ω·cm Physical Properties: Diamond Layer Thickness: 15 ± 5 µm Surface Roughness (Ra): Approximately 0.7 µm Grain Size: ≤20 µm Specifications: Dimensions: Wafer Diameter: Standard sizes include 2-inch, 4-inch, and 6-inch...
Read more