DIASEMI is a U.S.-based supplier and fabricator of MPCVD diamond materials.

DIASEMI is a U.S.-based supplier and fabricator of MPCVD diamond materials. Today we present one of our innovations: Diamond Heat Sink (16 pieces 20x0.5mm are available in stock)

Specification Overview:
Diamond heat sinks are designed for superior thermal management in high-power electronic and optoelectronic applications. Leveraging the exceptional properties of synthetic diamonds, these heat sinks deliver unparalleled thermal conductivity, electrical insulation, and mechanical stability, ensuring optimal performance and reliability in demanding environments.
Key Features:
Thermal Conductivity: Up to 2200 W/mK, offering industry-leading heat dissipation.
Electrical Insulation: Excellent dielectric properties for safe use in sensitive electronic devices.
Lightweight and Durable: High strength-to-weight ratio with exceptional hardness and wear resistance.
Thermal Expansion: Low coefficient of thermal expansion (CTE) compatible with common semiconductor materials.
Chemical Stability: High resistance to oxidation and chemical corrosion for long-term reliability.
Applications:
High-Power Semiconductor Devices: Ideal for managing heat in power amplifiers, RF devices, and laser diodes.
Optoelectronics: Ensures efficient cooling for LEDs, laser systems, and photonics.
5G/6G Communication Systems: Supports thermal management in base stations and high-power amplifiers.
Aerospace and Defense: Used in avionics, satellites, and high-performance radar systems.
Medical Equipment: Provides thermal regulation in high-precision diagnostic tools and devices.
Technical Specifications:
Thermal Conductivity: Up to 2200 W/mK
Dielectric Strength: ≥1000 V/mm
Density: ~3.5 g/cm³
Thermal Expansion Coefficient (CTE): ~0.8 ppm/°C
Operating Temperature: Up to 1000°C
Customization: Available in various sizes, shapes, and thicknesses to meet specific application requirements.
Benefits:
Enhanced device reliability and lifespan due to efficient thermal management.
Reduced risk of thermal damage in sensitive electronic components.
Improved performance in high-temperature and high-power applications.
Contact Information:
For more details or to request a quote, visit www.diasemi.us or email sales@semixicon.com