DIASEMI: Diamond-Coated Silicon Wafers
DIASEMI: Diamond-Coated Silicon Wafers
Product Overview: DIASEMI offers high-quality diamond-coated silicon wafers, combining the exceptional properties of diamond with the versatility of silicon substrates. These wafers are ideal for applications requiring superior thermal management, mechanical durability, and chemical resistance.
Key Features:
Material Composition:
Substrate: Monocrystalline silicon wafer
Coating: Chemical Vapor Deposition (CVD) diamond layer
Thermal Properties:
Thermal Conductivity: Diamond layer: 1800–2000 W/m·K
Operating Temperature Range: Up to 1000°C
Mechanical Properties:
Hardness: Diamond layer: Vickers hardness >70 GPa
Young’s Modulus: Diamond layer: ~1050 GPa
Electrical Properties:
Electrical Resistivity: Diamond layer: >10⁶ Ω·cm
Physical Properties:
Diamond Layer Thickness: 15 ± 5 µm
Surface Roughness (Ra): Approximately 0.7 µm
Grain Size: ≤20 µm
Specifications:
Dimensions:
Wafer Diameter: Standard sizes include 2-inch, 4-inch, and 6-inch; custom sizes available upon request
Wafer Thickness: Standard thicknesses range from 275 µm to 675 µm
Coating Uniformity:
Diamond layer uniformity maintained within ±10% across the wafer
Surface Quality:
Polished surface with Ra <1 µm
Applications:
Thermal Management:
Heat spreaders and sinks for high-power electronics
Optoelectronics:
Substrates for high-power laser diodes
Semiconductor Devices:
High-frequency and high-power electronic components
Research and Development:
Material science studies requiring diamond-silicon interfaces
Customization Options:
Coating Thickness:
Diamond layer thickness can be tailored to specific application requirements
Surface Finish:
Options for polished or as-deposited surfaces
Doping:
Possibility of n-type or p-type doping of the diamond layer for electronic applications
For detailed specifications, customization inquiries, or to request a quote, please contact us at sales@semixicon.com or visit our website at www.diasemi.us
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