Unlock Ultimate Performance with DIASEMI's CVD Diamond Substrates!

Unlock Ultimate Performance with DIASEMI's CVD Diamond Substrates!

DIASEMI, a U.S.-based supplier and manufacturer, proudly introduces its latest batch of 4-inch high-quality diamond substrates, perfect for advanced electronic heat sink applications. Our substrates boast superior optical quality and are available in a range of high thermal conductivity grades—1200, 1800, and 2200 W/mK—to match the demands of your project.

Customization is our specialty. Tailor specifications such as diameter, micro-thickness, micro-TTV, nanometer-level surface roughness, and micro-bow adjustments to your exact needs.

Explore precision with DIASEMI. Contact us at www.diasemi.us & sales@semixicon.com for samples or quotes.


SIZE: 1-4 INCH (SHAPE AND DIMENSION CUSTOMIZABLE)

GROWTH METHOD:  MPCVD

THICKNESS: 0.3-1.0mm

DENSITY:  3.52（×103Kg·m-3）

VIKERS HARDNESS:  80-100GPa

YOUNG’S MODULUS : 1050GPa

SURFACE ROUGHNESS:  Ra < 30nm

THERMAL CONDUCTIVITY:   1200-2000W/m·K

THERMAL EXPANSION: 1×10-6/K@300K

SPECIFIC HEAT CAPACITY:   0.502J/gK@300K

BOW: < 20μm@4inch；Bow< 5μm@2inch

WARPAGE:   < 20μm@4inch；< 5μm@2inch

TTV:     <20 µm

THICKNESS TOLERANCE:   ±0.05 mm

WARPAGE:  ≤10 µm



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