DIASEMI, a U.S.-based leader in CVD diamond materials, introduces Copper-Diamond Composite,

DIASEMI, a U.S.-based leader in CVD diamond materials, introduces Copper-Diamond Composite, an advanced material that combines diamond’s superior thermal conductivity with copper’s strength, ensuring exceptional heat dissipation for high-performance applications.

Key Features:

High Thermal Conductivity – Up to 420 W/m·K, outperforming pure copper.

Optimized CTE – Matches semiconductor materials for seamless integration.

Robust Mechanical Strength – Dense copper matrix for durability and stability.

Corrosion Resistance – Reliable performance in various environments.

Applications:

High-Power Electronics – Heat spreaders, substrates, and thermal management components.

Semiconductor Devices – Reliable operation in high-temperature conditions.

Advanced Thermal Solutions – Precision and efficiency for demanding industries.

Upgrade Your Thermal Management Today!

Visit www.diasemi.us or contact sales@semixicon.com for more information.


#cvddiamongcopper #copperdiamondcomposite #diamondcomposite #thermalmanagement #diamondheatspreader #corrosionresistance #cvddiamond

Comments

Post a Comment

Popular posts from this blog

DIASEMI is a U.S.-based supplier and fabricator of MPCVD diamond materials.

Image
DIASEMI is a U.S.-based supplier and fabricator of MPCVD diamond materials. Today we present one of our innovations: Diamond Heat Sink (16 pieces 20x0.5mm are available in stock) Specification Overview: Diamond heat sinks are designed for superior thermal management in high-power electronic and optoelectronic applications. Leveraging the exceptional properties of synthetic diamonds, these heat sinks deliver unparalleled thermal conductivity, electrical insulation, and mechanical stability, ensuring optimal performance and reliability in demanding environments. Key Features: Thermal Conductivity: Up to 2200 W/mK, offering industry-leading heat dissipation. Electrical Insulation: Excellent dielectric properties for safe use in sensitive electronic devices. Lightweight and Durable: High strength-to-weight ratio with exceptional hardness and wear resistance. Thermal Expansion: Low coefficient of thermal expansion (CTE) compatible with common semiconductor materials. Chemical Stability: Hi...
Read more

OPTICAL GRADE DIAMOND, Manufactured by DIASEMI, a U.S.-based company.

Image
OPTICAL GRADE DIAMOND, Manufactured by DIASEMI, a U.S.-based company. DIASEMI offers outstanding optical diamonds, with transmittance across UV, visible, IR, and microwave bands, with optical transmittance exceeding 70%. It is an exceptional optical material combining superior mechanical, thermal, and electrical properties with excellent chemical stability. Resilient against harsh environments, it adapts well to complex and fluctuating conditions. Single-crystalline diamond (>10mm): 71% infrared transmittance Polycrystalline diamond (1-4 inches): 68-70% infrared transmittance Applications span various fields, including: Infrared windows for airborne, missile, and ship-borne search and tracking systems High-power CO2 and solid-state laser weaponry High-energy microwave feed windows and weaponry Thermonuclear fusion reactors Optics such as windows, prisms, and lenses for spectroscopy and medical applications Specifications: Dimension: Customizable Thickness: Customizable Transmittance...
Read more

DIASEMI: Diamond-Coated Silicon Wafers

Image
DIASEMI: Diamond-Coated Silicon Wafers Product Overview: DIASEMI offers high-quality diamond-coated silicon wafers, combining the exceptional properties of diamond with the versatility of silicon substrates. These wafers are ideal for applications requiring superior thermal management, mechanical durability, and chemical resistance. Key Features: Material Composition: Substrate: Monocrystalline silicon wafer Coating: Chemical Vapor Deposition (CVD) diamond layer Thermal Properties: Thermal Conductivity: Diamond layer: 1800–2000 W/m·K Operating Temperature Range: Up to 1000°C Mechanical Properties: Hardness: Diamond layer: Vickers hardness >70 GPa Young’s Modulus: Diamond layer: ~1050 GPa Electrical Properties: Electrical Resistivity: Diamond layer: >10⁶ Ω·cm Physical Properties: Diamond Layer Thickness: 15 ± 5 µm Surface Roughness (Ra): Approximately 0.7 µm Grain Size: ≤20 µm Specifications: Dimensions: Wafer Diameter: Standard sizes include 2-inch, 4-inch, and 6-inch...
Read more