Wafer Edge Chamfer Grinding Wheel | Resin-Bond Diamond Wheel for Silicon Wafer Edge Processing – SEMIXICON

Wafer Edge Chamfer Grinding Wheel | Resin-Bond Diamond Wheel for Silicon Wafer Edge Processing – SEMIXICON

SEMIXICON is a trusted supplier of wafer edge chamfer grinding wheels, specializing in resin-bond diamond grinding wheels designed for precision silicon wafer edge chamfering. Our grinding solutions deliver smooth, chip-free edges critical for downstream semiconductor processing steps.
⚙️ Primary Function
To precisely grind and shape the edge of silicon wafers (e.g., 300mm / 12-inch), creating a smooth, rounded chamfer. This prevents chipping, cracking, and edge damage, ensuring stability for subsequent wafer thinning, polishing, and dicing.
📐 Specifications
Outer Diameter (O.D.): 100 mm (common standard size)
Inner Diameter (I.D.): 20 mm (fits standard spindle machines)
Thickness (Width): 3 – 5 mm (thin profile for precision grinding)
Grit Size: #2000 – #4000 (very fine grit for mirror-like edge finish)
Bond Type: Resin Bond (polymer matrix, fine finish, self-sharpening)
Diamond Type: Synthetic Diamond
Concentration: 75 – 100 (high density of diamond particles for long life and stability)
Max Operating Speed: 3,000 – 6,000 RPM (do not exceed rated speed)
🎯 Performance Features
Runout: < 0.005 mm – ensuring balanced, vibration-free operation
Surface Finish: Wafer edge roughness (Ra) < 0.01 µm for ultra-smooth finish
Chamfer Profile: Consistent T-type or R-type chamfer profiles per wafer specifications
Wafer Size Compatibility: Designed for 300mm wafers, with options available for 200mm and smaller wafers
📩 Contact us for a quote or customization
✉ Email: sales@semixicon.com
🌐 Website: www.semixicon.com
#DiamondGrindingWheel #WaferEdgeChamfer #SemiconductorProcessing #SiliconWafer #ResinBond #WaferFabrication #300mmWafer #WaferEdgeGrinding

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