Engineering Precision in Ultra-Pure Silicon Components | SEMIXICON

  Engineering Precision in Ultra-Pure Silicon Components | SEMIXICON

At SEMIXICON, we engineer the foundation of advanced semiconductor manufacturing — Ultra-High-Purity Silicon Components.
 For fabs running 200mm and 300mm wafer processes, our precision materials are critical to achieving superior yield, uniformity, and device performance.
Our Specialties
1. Semiconductor-Grade Polycrystalline Silicon Feedstock
 The base material for all critical silicon components.
Purity: >99.9999% (6N+) to meet stringent contamination control requirements.
Resistivity: >1,000 Ω·cm — ensures minimal dopant interference for epitaxial and crystal growth applications.
2. High-Density Silicon Sputtering Targets
 Designed for uniform thin-film deposition and minimal particle generation in advanced PVD systems.
Purity: Maintains 6N+ base purity.
Density: >99.5% of theoretical, reducing arcing and nodule formation.
Particle Performance: <0.05 particles/cm² (>0.2 µm) under baseline test conditions.
3. Dimensional-Stability Silicon Etch Rings
 Precision-machined components for plasma confinement and etch uniformity in dielectric and silicon etch chambers.
Material: Polycrystalline or single-crystal silicon for superior plasma erosion resistance.
Tolerance: Diameter held within ±0.2 mm for consistent plasma sheath control.
Particle Contribution: <0.01 particles/cm² per wafer cycle — maximizing uptime and yield.
The SEMIXICON Advantage
U.S.-Based Manufacturing: Secure, traceable supply chain with direct engineering support.
Designed for Performance: Every component is engineered to reduce process variation and defect density.
Built for Yield: Purity and precision are non-negotiable — they define every SEMIXICON part.
www.semixicon.com
sales@semixicon.com

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