SEMIXICON | DIASEMI – Copper Diamond Composite with Ni/Au/Pt Coating

SEMIXICON | DIASEMI – Copper Diamond Composite with Ni/Au/Pt Coating

SEMIXICON DIASEMI is a U.S.-based supplier and manufacturer specializing in copper diamond composite materials with Nickel (Ni), gold (Au), and platinum (Pt) coatings for advanced thermal management and semiconductor applications.

🔹 Coating Specifications

Nickel (Ni): 1–5 µm

Gold (Au): 0.5 µm

Platinum (Pt): 0.5 µm

Surface Roughness (Ra): 0.8 µm

Thermal Conductivity: >600 W/m·K

DIASEMI copper diamond composite with Au/Pt/Ni coatings offers exceptional thermal conductivity, high wear resistance, and superior reliability for semiconductor devices, power electronics, heat spreaders, thermal interface materials, aerospace, and defense applications.

🌐 Learn more: www.diasemi.us

📩 Contact: sales@semixicon.com

#CopperDiamondComposite #DiamondHeatSpreader #ThermalManagementMaterials #hermaldiffusivity #thermaldiffusivity

#thermalinterfacematerials #HighThermalConductivity #600WmK #GoldCoating #PlatinumCoating #NickelCoating #SemiconductorPackagingMaterials #PowerElectronicsCooling #AdvancedMaterialsSupplierUSA


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