Diamond Semiconductor

     SEMIXICON – Precision Silicon Carbide (SiC) Thinning Wheels for Semiconductor Wafer Back-Grinding SEMIXICON is a U.S.-based manufacturer specializing in high-precision Silicon Carbide (SiC) thinning wheels for semiconductor wafer processing. Our SiC wheels are engineered for back-thinning of silicon, GaAs, and compound semiconductor wafers, ensuring flatness, uniformity, and surface integrity essential for advanced chip manufacturing. Key Features & Specifications Abrasive Grain: Green Silicon Carbide (GC) – extremely hard and sharp, ideal for grinding hard and brittle materials such as silicon, gallium arsenide (GaAs), and sapphire. Bond Type: Vitrified (Ceramic) Bond – highly porous structure allows efficient chip clearance, cooling, and stable cutting performance. Structure: Porous Design – enhances coolant flow and prevents wheel loading by providing escape channels for swarf. Grit Size: #200 – #2000 (customizable based on application) Diameter (D): 100mm – 5...

SEMIXICON | DIASEMI – Copper Diamond Composite with Ni/Au/Pt Coating SEMIXICON DIASEMI is a U.S.-based supplier and manufacturer specializing in copper diamond composite materials with Nickel (Ni), gold (Au), and platinum (Pt) coatings for advanced thermal management and semiconductor applications. 🔹 Coating Specifications Nickel (Ni): 1–5 µm Gold (Au): 0.5 µm Platinum (Pt): 0.5 µm Surface Roughness (Ra): 0.8 µm Thermal Conductivity: >600 W/m·K DIASEMI copper diamond composite with Au/Pt/Ni coatings offers exceptional thermal conductivity, high wear resistance, and superior reliability for semiconductor devices, power electronics, heat spreaders, thermal interface materials, aerospace, and defense applications. 🌐 Learn more: www.diasemi.us 📩 Contact: sales@semixicon.com #CopperDiamondComposite #DiamondHeatSpreader #ThermalManagementMaterials #hermaldiffusivity #thermaldiffusivity #thermalinterfacematerials #HighThermalConductivity #600WmK #GoldCoating #PlatinumCoating #N...

    SEMIXICON Aluminum Nitride (AlN) Ceramic Heater – High-Speed Heating & Rapid Cooling Solution SEMIXICON is a professional manufacturer of Aluminum Nitride (AlN) ceramic heaters, engineered for applications requiring high-speed heating, rapid cooling, and excellent temperature uniformity. The heater integrates resistive heating and internal air cooling into a single compact structure, enabling high-efficiency thermal process control for advanced semiconductor and electronic packaging applications. Heating & Cooling Principle Resistive Heating Rapid Internal Air Cooling Key Engineering Advantages ✔ High Heating Rate Heating performance varies with heater size and voltage. AlN ceramic heater can achieve a heating rate of up to 200 °C per second, significantly improving process throughput. ✔ Rapid Cooling Performance In processes such as solder bonding and thermosetting resin curing, fast cooling below the curing temperature is critical. SEMIXICON heaters use compresse...

    SEMIXICON: Precision Engineered Vacuum Chucks for Advanced Wafer Processing Maximize your yield and process stability with SEMIXICON's high-performance vacuum chuck solutions. Specially designed for seamless integration with DISCO DGP8761 and DFL7361/7341 series equipment, our chucks are the industry standard for demanding DBG (Dicing Before Grinding) and SDBG (Stealth Dicing Before Grinding) workflows. Optimized for DISCO Systems Fully Compatible: Custom-fit vacuum chuck tables for DISCO DGP8761 Fully Automatic Grinder/Polishers and DFL7361 Laser Saws. Advanced Materials: Available in Porous Ceramic, SSiC (Sintered Silicon Carbide), and Alumina Nitride to ensure superior flatness and thermal stability. Warped Wafer Improvement: Specialized designs to enhance chucking performance on ultra-thin and warped wafers. The DBG & SDBG Advantage Our chucks are engineered to handle the unique stresses of "Dicing Before Grinding" processes: Enhanced Die Strength: Provides ri...

     DIASEMI Diamond/Copper (DiaCu) Composites for Advanced Thermal Management As SiC and GaN devices continue to increase in power density, conventional copper and aluminum heat sinks are no longer sufficient. Thermal resistance, CTE mismatch, and interfacial losses have become limiting factors in device reliability and performance. DIASEMI Diamond/Copper (DiaCu) composites are engineered to address these challenges by combining the ultra-high thermal conductivity of diamond with the mechanical robustness and manufacturability of copper, delivering a next-generation thermal management material for high-heat-flux applications. Key Engineering Advantages Ultra-High Thermal Conductivity Effective thermal conductivity: 600–1000 W/m·K Significantly higher than pure copper or aluminum Enables rapid heat spreading for localized hot spots in high-power devices Tailored Coefficient of Thermal Expansion (CTE) CTE adjustable from 5–10 ppm/K Closely matches Si, SiC, and GaN, reducin...