DIASEMI Diamond/Copper (DiaCu) Composites for Advanced Thermal Management

    DIASEMI Diamond/Copper (DiaCu) Composites for Advanced Thermal Management

As SiC and GaN devices continue to increase in power density, conventional copper and aluminum heat sinks are no longer sufficient. Thermal resistance, CTE mismatch, and interfacial losses have become limiting factors in device reliability and performance.

DIASEMI Diamond/Copper (DiaCu) composites are engineered to address these challenges by combining the ultra-high thermal conductivity of diamond with the mechanical robustness and manufacturability of copper, delivering a next-generation thermal management material for high-heat-flux applications.

Key Engineering Advantages

Ultra-High Thermal Conductivity

Effective thermal conductivity: 600–1000 W/m·K

Significantly higher than pure copper or aluminum

Enables rapid heat spreading for localized hot spots in high-power devices

Tailored Coefficient of Thermal Expansion (CTE)

CTE adjustable from 5–10 ppm/K

Closely matches Si, SiC, and GaN, reducing thermo-mechanical stress

Minimizes die cracking, delamination, and solder fatigue in advanced packaging

Low Interfacial Thermal Resistance

Proprietary carbide-forming interlayer technology

Strong diamond–copper bonding for efficient phonon and electron heat transfer

Improved long-term thermal stability under cycling conditions

Design Flexibility & Manufacturability

Available in ultra-thin plates, large-area heat spreaders, and complex geometries

Optional Au / Ag surface plating for soldering, sintering, or direct die attach

Suitable for integration into existing packaging and cooling architectures

Typical Applications

Semiconductor Lasers & RF Devices

High-performance laser diode and GaAs/GaN RF submounts

Stable thermal performance under continuous high power operation

Power Electronics

SiC MOSFETs, GaN power modules, EV inverters

Improved power density and reliability through efficient heat extraction

AI, HPC & Data Centers

Heat spreaders for high-heat-flux processors and accelerators

Supports next-generation chip power scaling

Aerospace & Defense

Lightweight, high-reliability thermal solutions for extreme environments

Excellent performance under thermal shock and vibration

Engineering Focus: Performance, Not Compromise

DIASEMI DiaCu composites are designed for engineers who need thermal performance without sacrificing mechanical integrity or package reliability.

📌 Custom dimensions, thicknesses, CTE targets, and thermal conductivity available upon request.

Contact DIASEMI

🌐 www.diasemi.us 📧 sales@semixicon.com

#Diamondcoppercomposite #DiaCu #Cudiamondheatspreader #metalmatrixcomposite #MMC #highthermalconductivitymaterial #lowCTEheatsink #SiCthermalmanagement #GaNRFcooling #semiconductorpackagingmaterial #carbideinterlayer #heatspreader #powerelectronicscooling


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