SEMIXICON – Precision Silicon Carbide (SiC) Thinning Wheels for Semiconductor Wafer Back-Grinding

    SEMIXICON – Precision Silicon Carbide (SiC) Thinning Wheels for Semiconductor Wafer Back-Grinding

SEMIXICON is a U.S.-based manufacturer specializing in high-precision Silicon Carbide (SiC) thinning wheels for semiconductor wafer processing. Our SiC wheels are engineered for back-thinning of silicon, GaAs, and compound semiconductor wafers, ensuring flatness, uniformity, and surface integrity essential for advanced chip manufacturing.
Key Features & Specifications
Abrasive Grain: Green Silicon Carbide (GC) – extremely hard and sharp, ideal for grinding hard and brittle materials such as silicon, gallium arsenide (GaAs), and sapphire.
Bond Type: Vitrified (Ceramic) Bond – highly porous structure allows efficient chip clearance, cooling, and stable cutting performance.
Structure: Porous Design – enhances coolant flow and prevents wheel loading by providing escape channels for swarf.
Grit Size: #200 – #2000 (customizable based on application)
Diameter (D): 100mm – 500mm
Bore (H): 32mm, 76.2mm, 127mm (other sizes available)
Thickness (T): 5mm – 20mm
Hardness Grade: Medium (K–N range) for optimal balance between wheel wear and self-sharpening.
Coolant: Use with specialized water-based grinding coolant for best surface finish and wheel life.
Operation Speed: Follow the maximum operating speed rating marked on the wheel.
Performance Advantages
Superior flatness and parallelism for advanced wafer thinning
Excellent thermal conductivity and grinding efficiency
Reduced surface damage and wafer breakage risk
Long tool life with stable cutting performance
🌐 www.semixicon.com
📧 sales@semixicon.com

#SiliconCarbideThinningWheel #SiCGrindingWheel #SemiconductorBackGrindingWheel #WaferThinningTool #GreenSiliconCarbideWheel #VitrifiedBondGrindingWheel #SiCAbrasiveWheel #WaferBacksideGrinding #GaAsWaferGrinding #SemiconductorPolishingWheel


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