SEMIXICON: Precision Engineered Vacuum Chucks for Advanced Wafer Processing

   SEMIXICON: Precision Engineered Vacuum Chucks for Advanced Wafer Processing

Maximize your yield and process stability with SEMIXICON's high-performance vacuum chuck solutions. Specially designed for seamless integration with DISCO DGP8761 and DFL7361/7341 series equipment, our chucks are the industry standard for demanding DBG (Dicing Before Grinding) and SDBG (Stealth Dicing Before Grinding) workflows.

Optimized for DISCO Systems

Fully Compatible: Custom-fit vacuum chuck tables for DISCO DGP8761 Fully Automatic Grinder/Polishers and DFL7361 Laser Saws.

Advanced Materials: Available in Porous Ceramic, SSiC (Sintered Silicon Carbide), and Alumina Nitride to ensure superior flatness and thermal stability.

Warped Wafer Improvement: Specialized designs to enhance chucking performance on ultra-thin and warped wafers.

The DBG & SDBG Advantage

Our chucks are engineered to handle the unique stresses of "Dicing Before Grinding" processes:

Enhanced Die Strength: Provides rigid support during backgrinding to eliminate backside chipping and edge cracks.

Precision Planarization: Achieves ultra-low TTV (Total Thickness Variation) for wafers thinned.

ESD Safe Solutions: High-reliability ESD-safe porous ceramic options to protect sensitive ICs from electrostatic discharge during high-speed processing.

Equipment Support: DISCO DGP8761, DFL7361, DFD6361, DAD series.

Process Applications: DBG, SDBG, Stealth Dicing™, Stress Relief, Backgrinding, Wafer Thinning.

Upgrade your thin-wafer handling today. Visit: www.semixicon.com Technical Inquiries: sales@semixicon.com or sales@semixicon.com

#PorousCeramicVacuumChuck #SiCPinChuck #ElectrostaticChuck #ESC #WaferCarrier #CeramicHeaters #HighPlanarity #LowTTV #HighRadialRigidity #ThermalConductivity #ChemicalCorrosionResistance


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